Brooke's Hysitron InstrSpect 360 provides quantitative characterization of mechanical properties for X-ray microscopy (XRM) and synchrotron radiation beamlines. This unique system can be used to perform various mechanical tests such as indentation, compression, fatigue, and bending, and can then be associated with 2D or 3D images of the host microscope.
**Technology, achieving maximum capability
Hysitron IntraSpect 360 adopts a unique piezoelectric weighing sensor, combined with a unique three plate capacitive sensor technology. This arrangement can significantly increase the available displacement range while maintaining an ultra-low noise floor. This unique design generates very little heat and provides stability when in contact with the sample. This is very important in the imaging process of computed tomography (μ CT) research, as data acquisition time may be long. The test lasted for 168 hours and was reliably performed in combination with Brooke's reference frequency correction technique. The system also includes Brooke's' execution 'and other control modules, as well as TriboScan software, for nanomechanical testing and automatic data analysis with feedback control.
Load displacement data from in-situ nanoindentation testing of South Yellow Pine and a series of two-dimensional image slices obtained during the testing period. When deformation is observed in the longitudinal plane, the load presses into the transverse plane.
**Exclusive design for performance
IntraSpect 360 features a seamless X-ray transparent observation window for unobstructed imaging and convenient μ CT studies of material deformation (including fracture and failure). The system has a maximum force of 10N and 80 μ m, making it a multifunctional choice for characterizing the internal deformation process of various materials such as composite materials, ceramics, metals, and natural or biological materials. Brooke's superior sensor technology in the industry provides * * * stability in 4D research of material failures, such as crack propagation in fiber matrix interfaces or void behavior in welded joints.